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    σχετικά με: wire pull test method
  2. Learn to get the right failure modes on wires or ribbons by performing a pull test. Tips for performing a pull test on wires or ribbons applying an upward force on samples.

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  1. Wire pull testing applies an upward force under wires and effectively pulling the wire away from the substrate or die. The purpose of wire pull testing is to measure bond strength, evaluate bond failure modalities, or determine compliance with specified bond strength requirements.

  2. IPC-TM-650 TEST METHODS MANUAL. 1.0 Scope The purpose of this test is to measure bond strengths, evaluate bond strength distributions, or determine compliance with specified bond strength requirements of the applicable acquisition document. This test may be applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead ...

  3. Test condition C: Wire pull (single bond) This test is normally employed for internal bonds at the die or substrate and the lead frame of microelectronic devices. The wire connecting the die or substrate shall be cut so as to provide two ends accessible for pull test.

  4. This test method provides a means for determining the strength and failure mode of a wire bonded to, and the corresponding interconnects on, a die or package bonding surface and may be performed on pre-encapsulation or post-encapsulation devices.

  5. 3.1.2 Test condition C - Wire pull (single bond). This test is normally employed for internal bonds at the die or substrate and the lead frame of microelectronic devices. The wire connecting the die or substrate shall be cut so as to provide two ends accessible for pull test.

  6. This manual is a guide advising what to consider and how to perform an optimal Wire Pull test. The focus of this manual is on wire- and ribbon pulls using wire hooks. However, we also cover Loop height measurement and briefly touch on topics like tweezer pull and peel testing of wires.

  7. Wire Pull Testing (WPT), or bond pull testing, is one of several available time-zero tests for wire bond strength and quality. It consists of applying an upward force under the wire to be tested, effectively pulling the wire away from the die.

  1. Διαφήμιση

    σχετικά με: wire pull test method
  2. Learn to get the right failure modes on wires or ribbons by performing a pull test. Tips for performing a pull test on wires or ribbons applying an upward force on samples.

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