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14 Οκτ 2024 · Discover the key differences between ENIG and OSP surface finishes in PCB manufacturing. Our guide covers the advantages, limitations, and ideal applications of each, helping you make an informed choice to meet your project’s performance and cost goals.
4 Απρ 2024 · The Purpose of this document is to provide a complete guide on Outside Processing feature in Manufacturing along with the list of FAQs and Common issues. Scope T his document will guide Users through setups in manufacturing cloud to use and execute OSP.
In Printed Circuit Boards, OSP stands for Organic Solderability Preservative, which mainly applies to copper pads. It selectively bonds to copper to prevent it from tarnishing on exposure to moisture. PCB OSP surface finish is environmentally friendly, given its lead-free material, and requires low maintenance.
Outside Processing (OSP) is a subcontracting process where certain operations in a process routing are performed by the subcontractor. This process can be leveraged by manufacturers who do not always have the capabilities or equipment to perform all the steps in their manufacturing process to produce their products.
The OSP surface treatment process refers to the formation of a protective layer to prevent oxidation on the PCB to improve the reliability and stability of the product. This article will give a detailed introduction to the OSP surface treatment process in the PCB process, including its process requirements and advantages.
11 Απρ 2023 · What is OSP? OSP (Organic Solderability Preservative) is a thin organic coating, typically 5.9 to 11.8 µin [0.15 to 0.30 µm] thick, designed to prevent the oxidation of copper to maintain solderability over an extended period.
11 Ιαν 2024 · OSP (Organic solderable preservatives) is a lead -free surface treatment process, which is mainly used for SMT surface -packed circuit boards.
