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Vapor phase soldering is the ideal process for modern soldering technology. Electronic assemblies can be soldered error-free in any design. Easily and flexibly adjustable temperature gradients ensure the optimum, absolutely reproducible temperature profile for every product.
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Batch Systems. Batch systems are particularly suitable for...
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Kübler Hightech-Beratung. Ebhauser Straße 1 D-72213...
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Vapor phase soldering – also known as condensation soldering...
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Since the foundation of ASSCON Systemtechnik-Elektronik GmbH...
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IBL Technologies speeds up vapor phase soldering with advanced batch systems at APEX. IBL Technologies, LLC announced plans to showcase its BLC 420 Batch Soldering Machine in Booth #1237 at the 2017 IPC APEX EXPO, scheduled to take place Feb. 14-16, 2017 at the San Diego Convention Center in Calif.
The vapor phase soldering process achieves perfect results on a wide range of assemblies, from flexible to multi-layer substrates, reliably without overheating. 0049-(0)8231-95889-0 | infoline@ibl-tech.com
Soldering out of the trunk! This concept was behind the development of the smallest ASSCON vapor phase soldering system. Due to its compact design, this equipment can be used without any restrictions wherever a normal 240V power connection is available.
In order to improve control of the condensation phase, Rehm has developed a patented injection process that allows the soldering procedure to be individually regulated. An optional vacuum module ensures void-free soldered joints – directly after the soldering process or as a pre-vacuum.
Vapor phase is the ideal process for modern soldering technology. Electronic assemblies can be soldered error-free in practically every design. Easily and flexibly adjustable temperature gradients ensure the optimal, reproducible temperature profile for each product.
Vapor Phase Soldering System Inline System for Large Scale Production Product Highlights. Maximum solder length up to 1,500mm; Product change without waiting times; Full traceability; Double track transport for high throughput; No overheating or destruction of electronic assemblies; Key Features. 70% less energy consumption; Max solder height 60mm
