Αποτελέσματα Αναζήτησης
Vapor phase soldering is the ideal process for modern soldering technology. Electronic assemblies can be soldered error-free in any design. Easily and flexibly adjustable temperature gradients ensure the optimum, absolutely reproducible temperature profile for every product.
- Products
Batch Systems. Batch systems are particularly suitable for...
- Sales
Kübler Hightech-Beratung. Ebhauser Straße 1 D-72213...
- Technology
This phase change, or condensation, occurs over the entire...
- Company
Company profile. ASSCON Systemtechnik-Elektronik GmbH was...
- Products
However, for greater process accuracy, higher quality solder joints, consistently repeatable heating, and lower reflow costs, vapor phase soldering (also known as condensation soldering or vapor phase reflow), is the most flexible, simplest and most reliable reflow soldering method.
This year at Productronica IBL received the “2017 GLOBAL Technology Award” for its Vacuum Solder System and IPS software. Void free soldering for highest quality demands. Best electrical power- and heat transfer. This is guaranteed by the VAC soldering systems from IBL.
Latest developments in vapor phase soldering technology provide a combination of Vapor Phase and vacuum soldering to get void free solder joints. This vacuum soldering technology becomes increasingly important since more and more power electronics need to be soldered on SMT boards.
Company profile. ASSCON Systemtechnik-Elektronik GmbH was founded in 1995 and can thus look back on more than 25 years of experience in vapor phase soldering. Since its foundation ASSCON has been pursuing its corporate principle of “Innovations for your lead!”
In order to improve control of the condensation phase, Rehm has developed a patented injection process that allows the soldering procedure to be individually regulated. An optional vacuum module ensures void-free soldered joints – directly after the soldering process or as a pre-vacuum.
Vapor phase is the ideal process for modern soldering technology. Electronic assemblies can be soldered error-free in practically every design. Easily and flexibly adjustable temperature gradients ensure the optimal, reproducible temperature profile for each product.
